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Filtrado por: Unit (Department) Mechanical Engineering Palabra clave Microelectronic packaging

Computational and experimental investigations of laser drilling and welding for microelectronic packaging

Palabra clave:

Microdrilling, Microelectronic packaging, Computational modeling, Laser micromachining, Optoelectronic holography, and Microwelding

Creador:

Han, Wei

Advisor:

Pryputniewicz, Ryszard J.

Editor:

Worcester Polytechnic Institute

Fecha de Creacion:

2004-05-13

Resource Type:

Dissertation

Degree:

PhD

Unit (Department):

Mechanical Engineering