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Signature Analysis of OD Grinding Processes with Applications in Monitoring and Diagnosis

Palavra-chave:

Signature Analysis and Grinding Processes

O Criador:

Tian, Wei

Advisor:

Rong, Yiming

Editor:

Worcester Polytechnic Institute

Data Criada:

2009-04-26

Resource Type:

Thesis

Degree:

MS

Unit (Department):

Manufacturing Engineering