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A Selective Encapsulation Solution For Packaging An Optical Micro Electro Mechanical System

Mot-clé:

die warpage, die bow, electronics, wirebonds, encapsulate, MEMS, packaging, micro electro mechanical systems, encapsulant, Corrosion, and electrochemical migration

Créateur:

Bowman, Amy Catherine

Advisor:

Sisson, Richard D.

Éditeur:

Worcester Polytechnic Institute

date créée:

2002-01-08

Resource Type:

Thesis

Degree:

MS

Unit (Department):

Materials Science & Engineering