Structural and Functional Integration Studies of POL Technology for SiC-based Integrated Modular Motor Drive Development

Vardi, Haggay

Student Work

Structural and Functional Integration Studies of POL Technology for SiC-based Integrated Modular Motor Drive Development

Public Deposited

This project sought to perform a thorough thermo-mechanical assessment of a SiC power overlay (POL) bi-directional switch for the purpose of determining the fitness of this novel power electronics technology for the application of integrated modular motor drives. This goal was accomplished by performing a thermo-mechanical comparative study using Finite Element Analysis (FEA) between the emerging POL architecture and traditional wire bonding techniques, and by performing electro-thermal characterization and reliability studies. This goal was further extended to define foundational bases for integrational studies of the device in IMMDs through a DOE-based optimization study. This project was able to affirm that POL can maintain the thermal performance of wire bond interconnections to a margin of 1% while significantly reducing the thermal stress at previously considered weakness points such as the sintering layer. This FEA study was also able to reduce the BDS volume by over 56% while maintaining its performance well under its 200℃, 9GPa threshold. As a result of these findings, several follow-up studies aimed at benchmarking the device’s performance, integrating it in IMMD, and verifying its performance through physical experimentation were suggested.

This report represents the work of one or more WPI undergraduate students submitted to the faculty as evidence of completion of a degree requirement. WPI routinely publishes these reports on its website without editorial or peer review.

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