An experiment was conducted on printed circuit board parameters with regards to the 0201 surface mounted component (.020 x .010 inches) and the defects affecting them by varying four of the process parameters. Although some of the alternative products performed just as well as those presently used by MIT Lincoln Laboratory; from a business standpoint it was recommended that the process parameters used by the laboratory remain the same; .005 inch laser cut stencil, SC3401 solder paste, and the RSS (1088) profile.

• This report represents the work of one or more WPI undergraduate students submitted to the faculty as evidence of completion of a degree requirement. WPI routinely publishes these reports on its website without editorial or peer review.

Creator

• Mojica, Elijah.
• Scobo, Jonathan Paul.

Publisher

• Worcester Polytechnic Institute

Identifier

• 05C030M

Advisor

• Johari, Hamid

Year

• 2005

Center

• MIT Lincoln Laboratory-Lexington, Massachusetts Project Center - MQP

Sponsor

• MIT Lincoln Laboratory

Date created

• 2005-01-01

Resource type

• Major Qualifying Project

Major

• Mechanical Engineering

Rights statement

• In Copyright