Residual Stress in RF MEMS switchesPublic
RF MEMS cantilever beam switches have many applications; however the residual stress built into these devices during fabrication constricts their use. During fabrication, the electroplating process was believed to be the main culprit of stress. The temperature and the time, which affects the bridge thickness, were varied. It was found that as both the temperature and thickness increased the residual stress increased. The residual stress observed was due to temperature gradients as well as chemical stability of the plating solution.
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